C11S-S Ceramic Fiber Aerogel Insulation Sheet
Category: Thermal Insulation Range
Product Details
The C11S‑S ceramic fiber aerogel insulation sheet is manufactured by combining a ceramic fiber felt with silica aerogel via supercritical drying, resulting in a lightweight, porous material with a three-dimensional network of nanoscale pores. It is applied using either membrane encapsulation or adhesive coating. At room temperature, its thermal conductivity is as low as 0.025 W/(m·K) or less.
Product features: high‑efficiency thermal insulation, high compression ratio, flexible packaging options, and suitability for a wide range of applications.
Technical Specifications
| Performance Name | Unit | Performance value |
| Thickness | mm | ≥1.0 |
| Core material density | g/m² | 240-400 |
| Thermal conductivity at 25°C | W/(m·K) | ≤0.025 |
| Thermal conductivity at 300°C | W/(m·K) | ≤0.035 |
| Thermal conductivity at 500°C | W/(m·K) | ≤0.055 |
| Thermal conductivity at 800°C | W/(m·K) | ≤0.120 |
| Dielectric withstand voltage @ DC 5000 V, 60 s | mA | I (leakage) < 0.1 |
| Insulation resistance @ DC 1000 V, 60 s | MΩ | > 1000 |
| Compression ratio @0.15 MPa | % | 8~18 |
| Compression ratio @0.9 MPa | % | 24~43 |
| Compression ratio @2.0 MPa | % | 35~65 |
| Temperature resistance | °C | ≤1000 |
| Water absorption rate | % | ≤2 |
| Flame-retardant performance UL94 | / | V-0 |
| Prohibited substances RoHS 2.0/ELV | / | Qualified |
Key Performance
Compression Performance:
Inlet pressure: 0.008 MPa; loading rate: 2 mm/min; testing continued until the compressive stress reached 0.9 MPa, at which point the test was terminated.
C11S-S Compressive Stress–Strain Curve
Keywords:C11S-S Ceramic Fiber Aerogel Insulation Sheet
C11S-S Ceramic Fiber Aerogel Insulation Sheet
The C11S‑S ceramic fiber aerogel insulation sheet is manufactured by combining a ceramic fiber felt with silica aerogel via supercritical drying, yielding a lightweight porous material with a three-dimensional network of nanoscale pores. It is applied using membrane‑type encapsulation or adhesive coating. At room temperature, its thermal conductivity is as low as 0.025 W/(m·K) or less.
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