High-enthalpy foam plastic

High-enthalpy foam plastic

Category: New Material Series

P63M is a two-component polyurethane foam adhesive, suitable for structural bonding applications requiring low density, medium hardness, heat absorption, thermal insulation, and flame retardancy. It provides thermal management at the bond line, delivering effective thermal control within a temperature range of 40–55°C while ensuring mechanical stability.

Product Details

P63M is a two-component polyurethane foam adhesive, suitable for structural bonding applications requiring low density, medium hardness, heat absorption, thermal insulation, and flame retardancy. It provides thermal management at the bond line, delivering effective thermal control within a temperature range of 40–55°C while ensuring mechanical stability.
Product features: Thermal-insulating, flame-retardant structural adhesive with precise temperature control between 40–55°C.
Application areas: Suitable for potting and bonding in new‑energy battery PACKs.

Technical Specifications

Performance Name Unit P63M(A) P63M(B)
Chemical substrate / Polyol Isocyanate
Density Uncured g/cm³ 1.07 1.18
Curing 0.40~0.45
Mixing ratio by weight A : B = 153.6 : 108
Viscosity mPa · s 16,000~20,000 1000~3000
Milky White Time minutes 2~3
Latent heat value J/g 53 ± 5
Phase transition temperature °C 40~55
Tensile strength MPa >0.8
Shear strength MPa >0.8
Shelf life (10–30°C) months 6

Key Performance

Thermodynamic properties:
DSC, temperature range 30–100 °C, heating rate 5 °C/min

The latent heat of phase change for the P63M heat-absorbing plate is 53.81 J/g.
The phase-change temperature of the heat-absorbing plate is 49.24 °C.

Application Instructions

Instructions for use:
1. Surface preparation: The surface must be clean, dry, and free of oil, dust, and contaminants.
Following the cleaning process, pre‑treatment may be required depending on the type of substrate to be bonded, and the specific pre‑treatment method must be validated by testing. During curing, CO2 is generated; if the substrate is non‑porous, appropriate measures must be taken to allow the carbon dioxide to escape.
2. Manual application procedure: Before use, stir components A and B separately to prevent sedimentation or layering and to avoid entrapping air in the product. Mix components A and B according to the specified ratio, and stir thoroughly to ensure uniform blending. Apply the mixture before half of its pot life has elapsed, and bond the parts together within the working time.
Note: If mixed in large quantities, the exothermic reaction will significantly shorten the pot life and working time.
Hands and exposed skin must be washed immediately with wet wipes or an appropriate industrial hand sanitizer and water; do not use solvents on the skin.
Curing mechanism: The curing of P63M is temperature‑dependent, with the curing rate directly proportional to temperature.
Storage conditions:
P63M must be stored in a dry location, with the temperature maintained between 10°C and 30°C, and protected from direct sunlight and frost. After opening the package, the contents must be kept away from moisture.

Keywords:High-enthalpy foam plastic

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High-enthalpy foam plastic

P63M is a two-component polyurethane foam adhesive, suitable for structural bonding applications requiring low density, medium hardness, heat absorption, thermal insulation, and flame retardancy. It provides thermal management at the bond line, delivering effective thermal control within a temperature range of 40–55°C while ensuring mechanical stability.

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